邹贵生-凯发平台

邹贵生

工学博士，长聘教授

电子邮箱：zougsh@tsinghua.edu.cn

通信地址👼🏼：北京K8凯发平台娱乐开户官方网站李兆基科技大楼（凯发平台）A706室🚚，100084

1996.03 - 2000.05 凯发平台，获工学博士学位

1988.09 - 1991.06 西安交通大学凯发平台🏛，获工学硕士学位

1984.09 - 1988.06 西安交通大学凯发平台🤘，获工学学士学位

1. 超快激光微纳成形制造及器件

超快激光与物质的相互作用机理
超快激光微细制孔、精密抛光等
超快激光表面有序微纳米结构高效制备及应用
飞秒激光制备传感器、微流体通道及表面沉积镀膜(3D)等

2. 微纳连接成形制造及应用

微纳连接的新方法及理论
材料微纳连接的尺寸效应
微纳尺度连接技术与装备
微纳尺度连接建模与仿真
电子封装新材料及新工艺
微纳连接接头及其元器件和系统的可靠性评估
纳米金属焊膏合成新方法及其低温烧结连接技术与应用
微纳连接在MEMS、生物医疗器件🐜、超微物质检测传感器等制造中应用

3. 新材料和异种材料连接冶金及技术

1）新材料和特种材料焊接

铝基和镁基复合材料👋🏻、超导材料🧗🏿、陶瓷材料、金属间化合物基材料等

2）焊接新材料和焊接新工艺

特种连接材料研制
低温连接技术😻、表面改性连接技术
钎焊和超声辅助钎焊🧑‍🍼、微束等离子焊、扩散焊、TLPB、激光焊💝、电阻焊

3）异种材料连接界面冶金行为和控制

Si3N4/SiC/Al2O3等各种陶瓷与各种金属之间焊接
铝合金/镁、钛、铜🤵🏽‍♀️，钽/不锈钢，石墨/铜📝，异质钢等异种金属之间焊接

4. 材料加工过程物理模拟及其质量控制研究

过程模拟👉🏽：热轧、锻造、扩散焊、热处理和焊接热影响区受热等过程模拟
性能试验：拉伸/压缩、热塑性、真应变-应力🏃‍➡️、CCT及TTT曲线等
材料基础研究：扩散💇🏻‍♂️、熔化及控制凝固、应力松弛🤶🏿、再结晶、加工硬化等

研究项目

部分基础研究项目

1. 激光高性能连接技术与装备（科技部重点研发专项“增材制造与激光制造”中项目2017YFB1104900：2017.07~2021.06，项目负责人和课题负责人）

2. 基于纳米金属颗粒并面向微纳器件封装的低温连接新原理与新技术(国家自然科学基金重点国际合作项目51520105007🤾🏽🎒，2016.01~2020.12🥻，负责人）

3. 铋系高温超导带材节能高效成形加工基础研究（国家自然科学基金重点项目50635050: 2007.01~2010.12👱🏻，项目负责人：曾攀，本人为“节能高效连接研究”专题负责人）

4. 汽车用高强塑积钢激光焊接及成型关键技术（国家国际科技合作专项项目2015DFA51460：2015.4.1~2018.3.31，项目负责人🖐🏼：田志凌，本人为项目合作研究清华部分的负责人）

5. 超短脉冲激光微纳尺度连接技术及其冶金结合机理研究（国家自然科学基金项目51375261☂️：2014.01~2017.12🤚🏿，负责人）

6. 超导相原位生成高温加压高效连接Bi系带材及机理（国家自然科学基金项目50575114: 2006.01~2008.12，负责人）

7. 纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理（国家自然科学基金项目51075232: 2011.01~2013.12, 负责人）

8. 钇系块材钎缝织构生成及超导电性快速恢复的技术与机理（国家自然科学基金青年项目50705050: 2008.01~2010.12，主要成员。负责人郭伟为本人的博士后）

9. 半固态连接陶瓷及其复合材料的机理与工艺（国家自然科学基金项目50075046: 2001.01~2003.12，主要成员）

10. 非真空过渡液相扩散焊接陶瓷的机理和工艺（国家自然科学基金项目59675056: 1997.01~1999.12🦹🏻‍♀️，主要研究人员）

11. 高性能钇系超导块材大尺寸化的钎焊法制备技术与机理（北京市自然科学基金项目3093020: 2009.01~ 2010.06❓，负责人）

12. 铋系超导带材的连接材料研制与连接机理（北京市自然科学基金项目3052010: 2005.01~2007.12🧚🏿，负责人）

13. 大气无钎剂条件下轻质有色金属的超声波辅助钎焊新技术研究（CAST创新基金重点项目⬜️：2016.01~2017.06，北京K8凯发平台娱乐开户官方网站研究内容负责人）

14. 无铅纳米金属焊膏研制及其低温烧结连接高温服役的电子封装应用研究（北京K8凯发平台娱乐开户官方网站汽车安全与节能国家重点实验室开发基金项目2013XC-B-02：2013.12~2015.06，负责人）

15. 热端透平叶片气膜冷却孔的特种加工与检测(北京K8凯发平台娱乐开户官方网站自主科研计划研究重点项目20131089209🧚🏻：2014.01~2016.12🧘🏼‍♀️，超快激光制孔研究负责人）

部分科技攻关项目

1. 特种金属的精密扩散焊和超高真空封接（重大科技攻关项目的分项目，主要成员）

2. 高温超导材料的连接技术研究(863项目2002AA306113的横向合作项目🎄，项目负责人)

3. 复合结构的轧制/扩散复合技术基础研究(863项目2002AA334070，参加)

4. 陶瓷挺柱中试关键技术研究（“九五”攻关项目☝🏿，参加）

部分横向合作项目

1. 2319焊丝性能研究

2. 硬质合金与不锈钢的钎焊

3. 钽箔与不锈钢的压力钎焊

4. 典型Al-Li合金的焊接性评估

5. 特种功能器件的精密钎焊技术

6. 宽禁带半导体功率器件封装技术

7. 490MPa和590MPa级焊丝焊接性能评估

8. Ti3Al基合金激光焊接工艺和TLP扩散连接技术

9. 大型储罐焊材国产化－焊接接头组织和性能分析

10. 高频数据线无铅低温钎焊焊点缺陷成因分析及改善

11. Research on Head-in-Pillow effect in BGA SMT and its solution

12. Investigation and Performance Evaluation of Lead Free Nano-solder Paste for Pitch SMT

主要出版物

论著、技术手册与教材

1. Chai Xiao, Zou Guisheng, Guo Wei, Wu Aiping, Ren Jialie. Chapter 9: Fast superconductive joining of Y-Ba-Cu-O bulks with high quality. Edited in Superconductivity: Theory, Materials and Applications, Nova Science Publishers, Inc. (Editors: Vladimir Rem Romanovskii: Russian Research Center, Kurchatov Institute, Institute for Superconductivity and Solid State Physics, Moscow, Russia), 2012: 419-436 (ISBN: 978-1-61324-843-0)

2. Guo Wei, Zou Guisheng, Wu Aiping, Ren Jialie.Chapter 12: Joining of High Temperature Superconducting BSCCO/Ag Tapes. Edited in Superconductivity: Theory, Materials and Applications, Nova Science Publishers, Inc. (Editors: Vladimir Rem Romanovskii: Russian Research Center, Kurchatov Institute, Institute for Superconductivity and Solid State Physics, Moscow, Russia), 2012: 503-512 (ISBN: 978-1-61324-843-0)

3. Zou Guisheng. Joining of high temperature superconductors. Edited by Prof. Norman Zhou with University of Waterloo,Canada; edited in Micro-joining and nano-joining, Woodhead Publishing Ltd., U.K, 2008: 583-619

4. 邹贵生主编, 黄天佑副主编. 材料加工系列实验. 北京K8凯发平台娱乐开户官方网站出版社, 2005.3

5. 史耀武主编. 焊接技术手册（本人编写66页）, 福建科学技术出版社, 2005.4

6. 李言祥主编, 吴爱萍副主编. 材料加工原理（本人编写64页）. 北京K8凯发平台娱乐开户官方网站出版社, 2005.6

SCI期刊论文

110. Songling Xing, Luchan Lin, Jinpeng Huo, Guisheng Zou, Lei Liu, Yunhong Zhou. Plasmon induced heterointerface thinning for Schottky barrier modification of core/shell SiC/SiO2 nanowire. ACS Applied Materials & Interfaces, 2019. (In Press)

109. Hongqiang Zhang, Hailin Bai, Peng Peng, Wei Guo, Guisheng Zou, Lei Liu. SiC chip attachments sintered by nano-silver paste and their shear strength evaluation. Welding in the World. (In Press)

108. ZHENYU ZHAO, HONGQIANG ZHANG, GUISHENG ZOU, HUI REN, WEIDONG ZHUANG, LEI LIU and Y. NORMAN ZHOU. A Predictive Model for Thermal Conductivity of Nano-Ag Sintered Interconnect for a SiC Die. Journal of Electronic Materials, 2019 (https://doi.org/10.1007/s11664-019-06984-3, 2019 The Minerals, Metals & Materials Society) (In Press)

107. Hongqiang Zhang, Zhenyu Zhao, Guisheng Zou, Wengan Wang, Lei Liu, Gong Zhang, Y. Zhou. Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications. Microelectronics Reliability, 2019. (In Press)

106. Zhang, HQ; Wang, WG; Bai, HL; Zou, GS; Liu, L; Peng, P; Guo, W. Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications. JOURNAL OF ALLOYS AND COMPOUNDS, 774(2), 2019: 487-494. (SCI:000449743600055；EI:20184105937590)

105. Y. Ye, G. Zou, W. Long, Q. Jia, H. Bai, A. Wu, L. Liu*. Diffusion Brazing Repair of In738 Superalloy with Crack-Like Defect: Microstructure and Tensile Properties at High Temperatures. Science and Technology of Welding and Joining. 2018, 24(1): 52-62:52-62. (SCI: 000449305400007; EI: 20182305282830)

104. Ziyu Liu, Jian Cai*, Qian Wang, Zheyao Wang, Lei Liu, Guisheng Zou. Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate. Journal of Alloys and Compounds 767, 2018:575-582. (SCI: WOS: 000446316500071; EI: 20182905572920)

103. Z. Zhao, G. Zou, H. Zhang, H. Ren, L. Liu*, Y. N. Zhou. The Mechanism of Pore Segregation in the Sintered Nano Ag for High Temperature Power Electronics Applications. Materials Letters. 2018, 228, 168-171. (SCI: 000439045500043; EI: 20182405298574)

102. Qiang Jia, Lei Liu, Wei Guo, Yun Peng, Guisheng Zou, Zhiling Tian and Y. Norman Zhou. Microstructure and Tensile-Shear Properties of Resistance Spot-Welded Medium Mn Steel. Metals 2018, 48(8): 1-13. (SCI: 000427529100048)

101. Qiang Jia, Wei Guo*, Zhandong Wan, Yun Peng, Guisheng Zou*, Zhiling Tian, Y. Norman Zhou. Microstructure and mechanical properties of laser welded dissimilar joints between QP and boron alloyed martensitic steels. Journal of Materials Processing Tech. 259, 2018:58-67. . (SCI: 000437814500006; EI: 20181705038440)

100. Yilun Huang, Yuyao Li, Qianming Gong, Guanlei Zhao,Pengjie Zheng, Junfei Bai,Jianning Gan, Ming Zhao,Yang Shao, Dazhi Wang, Lei Liu, Guisheng Zou, Daming Zhuang, Ji Liang🗻🛕， Hongwei Zhu, and Cewen Nan. Hierarchically Mesostructured Aluminum Current Collector for Enhancing the Performance of Supercapacitors. ACS Appl. Mater. Interfaces, 2018, 10(19): 16572-16580. (SCI: 000432753800038; EI: 20181905173888)

99. Changbo Liu, Qianyi Zhang, Dan Wang, Guanlei Zhao, Xue Cai, Lizhu Li, He Ding, Kaiyuan Zhang, Huachun Wang, Deying Kong, Lan Yin, Lei Liu, Guisheng Zou, Lingyun Zhao, and Xing Sheng*. High Performance, Biocompatible Dielectric Thin-Film Optical Filters Integrated with Flexible Substrates and Microscale Optoelectronic Devices. Adv. Optical Mater. 2018, 1800146-01-08. (SCI: 000440815200010; EI: 20182205257712)

98. Ziyu Liu, Jian Cai *, Qian Wang, Lei Liu, Guisheng Zou. Modified pulse laser deposition of Ag nanostructure as intermediate for low temperature Cu-Cu bonding. Applied Surface Science 445, 2018: 16-23. (SCI: 000430477900003; EI: 20181204934101)

97. Y. Ye, G. Zou, W. Long, H. Bai, A. Wu, L. Liu*, Y. Zhou. TLP repaired IN738LC superalloy with uneven surface defect gap width after post heat treatment: Microstructure and mechanical properties. Journal of Alloys and Compounds 748, 2018: 26-35.(SCI: 000429838900004; EI: 20181104906339)

96. DAOZHI SHEN, GUISHENG ZOU, LEI LIU*, AIPING WU, WALTER W. DULEY, AND Y. NORMAN ZHOU. Investigation of impact and spreading of molten nanosized gold droplets on solid surfaces. Applied Optics, 2018, 57(9): 2080-2086. (SCI: 000427941900016; EI: 20181204928558)

95. Daozhi Shen, Guisheng Zou, Lei Liu*, Wenzheng Zhao, Aiping Wu, Walter W. Duley, and Y. Norman Zhou. Scalable High-Performance Ultraminiature Graphene Micro-Supercapacitors by a Hybrid Technique Combining Direct Writing and Controllable Microdroplet Transfer. ACS Applied Materials & Interfaces, 2018: 10, 5404🧑🏽‍🏭？5412. (SCI: 000425572700028; EI: 20180704808823)

94. Daozhi Shen, Ming Xiao, Guisheng Zou, Lei Liu*, Walter W. Duley, and Y. Norman Zhou*. Self-powered wearable electronics based on moisture enabled electricity generation. Advanced Materials, 2018: 1705925-01-08. (封面文章). (SCI: 000431615100008; EI: 20181304949075)

93. Zheyuan Huanga,b, Huiqiao Duc, Lei Liub, Zhiwei Laib,d,e, Xiaoguang Chenb, Weimin Longf,Wenxian Wanga,*, Guisheng Zoub,*. Ultrasonic effect mechanism on transient liquid phase bonding joints of SiCp reinforced Mg metal matrix composites using Zn-Al-Zn multi-interlayer. Ultrasonics-Sonochemistry, 2018, 43: 101-109. (SCI: 000429511800012; EI: 20180204632328)

92. Zhiwei Laia,b,c,d, Chuan Panc, Huiqiao Due, Xiaoguang Chenb, Ruishan Xieb,*, Lei Liub, Weimin Longf and Guisheng Zoub,*. Ultrasonic-assisted fluxless reactive bonding of Mg/Al dissimilar alloy using Zn–Al solder in air. Science and Technology of Welding and Joining, 2018, 23(1):19-27. (SCI 000418710500004; EI 20171603586255)

91. JIANFENG YAN, DONGYUE ZHANG, GUISHENG ZOU, LEI LIU, and Y. NORMAN ZHOU. Preparation of Oxidation-Resistant Ag-Cu Alloy Nanoparticles by Polyol Method for Electronic Packaging. Journal of ELECTRONIC MATERIALS. 48(2), 2019: 1286-1293. (SCI: 000455263100063; EI: 20184706108524)

90. Yudian Bao, Aiping Wu, Huakai Shao, Yue Zhao, Lei Liu, and Guisheng Zou. Microstructural evolution and mechanical reliability of transient liquid phase sintered joint during thermal aging. J Mater Sci, 2019, 54:765-776. (SCI: 000447384700060; EI: 20183605768047)

89. Yudian Bao, Aiping Wu, Huakai Shao, Yue Zhao, Guisheng Zou. Effect of powders on microstructures and mechanical properties for Sn–Ag transient liquid phase bonding in air . Journal of Materials Science: Materials in Electronics, 2018, 29: 10246-10257. (SCI: SCI:000433031400056; EI: 20182105237407)

88. Xing, Songling; Lin, Luchan; Zou, Guisheng; Liu, Lei*; Peng, Peng; Wu, Aiping; Duley, Walter; Zhou, Norman. Improving the electrical contact at a Pt/TiO2 nanowire interface by selective application of focused femtosecond laser irradiation. Nanotechnology, 2017(Online: Nanotechnology 28, 2017: 405302 (8pp); Https:// doi.org/10.1088/1361-6528/aa9150. (SCI: 000410610400002; EI: 20173804189583)

87. Y. Ye, J. Wei, G. Zou, W. Long, H. Bai, A. Wu & L. Liu*. Microstructure of diffusion-brazing repaired IN738LC superalloy with uneven surface defect gap width Science and Technology of Welding and Joining, 2017, 22(7): 617-626. (SCI: 000406522500010; EI: 20170803382046)

86. Jia Q, Guo W, Li W, Zhu Y, Peng P, Zou G, Yun P, Tian Z. Experimental and numerical study on local mechanical properties and failure analysis of laser welded DP980 steels. Materials Science and Engineering A. 680, 2017: 378-387. (SCI: 000390495600045)

85. 贾强, 郭伟, 彭鹏, 朱颖. 邹贵生. DP980 激光焊接温度场模拟及力学性能.稀有金属材料与工程, 46(7), 2017: 1905-1911. (SCI: 000407092900027)

84. J. Wei, Y. Ye, Z. Sun, G. Zou, H. Bai, A. Wu, L. Liu. Effects of the borideson themechanical properties of TLPB repaired Inconel 738 superalloy. Metallurgical and Materials Transactions A, 48A, (10), 2017: 4623-4633. (SCI:000408884300020; EI:20173304049416)

83. Huakai Shao, Aiping Wu, Yudian Bao, Yue Zhao, Lei Liu, Guisheng Zou. Interactions at the planar Ag3Sn/liquid Sn interface under ultrasonic irradiation. Ultrasonics - Sonochemistry, 39, 2017: 758-764. (SCI: 000407185600083)

82. Shao H, Wu A, Bao Y, Zhao Y, Liu L, Zou G. Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound. Ultrasonics Sonochemistry. 2017, 37: 561-570. (SCI: 000403120900064r)

81. Shao H, Wu A, Bao Y, Zhao Y, Zou G. Microstructure characterization and mechanical behavior for Ag3Sn joint produced by foil-based TLP bonding in air atmosphere. Materials Science and Engineering: A. 2017, 680: 221-231. (SCI: EF7FN)

80. Shao H, Wu A, Bao Y, Zhao Y, Zou G. Mechanism of Ag3Sn grain growth in Ag/Sn transient liquid phase soldering. Transactions of Nonferrous Metals Society of China. 2017, 27: 722-732. (SCI: ER6PW)

79. Peng Peng, Wei Guo, Ying Zhu, Lei Liu, Guisheng Zou, Y. Norman Zhou. Nanoscale Wire Bonding of Individual Ag Nanowires on Au Substrate at Room Temperature. Nano-Micro Lett. 2017, (9)26: 1-6. (SCI: 000397153700002)

78. Zhiwei Lai, Ruishan Xie*, Chuan Pan, Xiaoguang Chen, Lei Liu, WenxianWang, Guisheng Zou*. Ultrasound-assisted transient liquid phase bonding of magnesium alloy using brass interlayer in air. Journal of Materials Science & Technology, 2017,33:567-572. (SCI: 000406151300009; EI:20165203187021）

77. Xiaoguang Chen*, Ruishan Xie, Zhiwei Lai, Lei Liu, Jiuchun Yan*, Guisheng Zou. Interfacial Structure and Formation Mechanism of Ultrasonic-assisted Brazed Joint of SiC Ceramics with Al12Si Filler Metals in Air. Journal of Materials Science & Technology, 2017, 33:492-49. (SCI 000403530500013；EI:20161302164837)

76. Wei Guo, Hongqiang Zhang, Xiaoying Zhang, Lei Liu, Peng Peng, Guisheng Zou*, Y.Norman Zhou. Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering. Journal of Alloys and Compounds 690, 2017: 86-94. (SCI: 000385901300013; EI: 20163402735381)

75. Hongqiang Zhang, Guisheng Zou, Lei Liu, Hao Tong, Yong Li, Hailin, Bai, Aiping Wu. Synthesis of silver nanoparticles using large area arc discharge and its application in electronic packaging. Journal of Materials Science, 2017, 52:3375-3387. (SCI: 000390125500035; EI: 20165003108886)

74. Hongqiang Zhang, Guisheng Zou, Lei Liu, Yong Li, Hao Tong, Zhenguo Sun, Y.Norman Zhou, A Comparative study of silver nanoparticles synthesized by arc discharge and femtosecond laser in aqueous solution. Applied Physics A-Materials Sciences and Processing, 2016, 122: 896-909. (SCI: 000384753800026, EI: 20163902836893)

73. Luchan Lin, Lei Liu, Kevin Musselman, Guisheng Zou, Walt W. Duley, and Y. Norman Zhou*. Plasmonic-Radiation-Enhanced Metal Oxide Nanowire Heterojunctions for Controllable Multilevel Memory. Adv. Funct. Mater. 2016, 26: 5979-5986（封面文章IF:11.38; SCI: 000383609100003; EI: 20162902605558)

72. Luchan Lin, Guisheng Zou, Lei Liu, Walt W. Duley, Y. Norman Zhou. Plasmonic engineering of metal-oxide nanowire heterojunctions in integrated nanowire rectification units，Appl. Phys. Lett. 108, 2016: 203107-1-203107-5. (SCI: 000377024000044; EI: 20162302462153)

71. Yingchuan Zhang, Guisheng Zou, Lei Liu, Yue Zhao, Qiong Liang, Aiping Wu, Y. Norman Zhou. Time-dependent wettability of nano-patterned surfaces fabricated by femtosecond laser with high efficiency. Applied Surface Science 389, 2016, 554-559. (SCI: 000384577600068; EI: 20163202692389)

70. Jia Q, Guo W, Li W, Zhu Y, Peng P, Zou G. Microstructure and tensile behavior of fiber laser-welded blanks of DP600 and DP980 steels. Journal of Materials Processing Technology 2016; 236: 73-83. (SCI 000379559200009; EI: 20162102424439)

69. Ku Kang, Zhicao Feng, G.S. Frankel, Jichao Li, Guisheng Zou, Aiping Wu. Effect of Precipitate Evolution on the Pitting Corrosion of Friction Stir Welded Joints of an Al-Cu Alloy. Corrosion, 2016, 72(6): 719-731. (SCI 000383391600001; EI: 20162402501229)

68. Zhenyu Zhao, Lei Liu, Hyun Seok Choi, Jian Cai, QianWang, YumingWang, Guisheng Zou. Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn-3.0Ag-0.5Cu solder joints. Microelectronics Reliability 60, 2016: 126–134. (SCI: 000375516200018; EI: 20161102093371)

67. Huakai Shao, Aiping Wu, Yudian Bao, Yue Zhao, Guisheng Zou.Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding. J Mater Sci: Mater Electron, 2016, 27:4839-4848. (SCI: 000373742500089; EI: 20160501869824）

66. Y.Zhang, G.Zou, L.Liu, A.Wu, Z.Sun, Y.N.Zhou. Vacuum brazing of alumina to stainless steel using femtosecond laser patterned periodic surfacestructure. Materials Science & Engineering A662, 2016: 178-184. (SCI 000375164300022; EI 20161202135980)

65. Qiang Jia, Wei Guo, Peng Peng, Minggao Li, Ying Zhu & Guisheng Zou. Microstructure- and Strain Rate-Dependent Tensile Behavior of Fiber Laser-Welded DP980 Steel Joint (JMEP-15-07-8678.R1). Journal of Materials Engineering and Performance, 2016, 25(2): 668-676. (SCI 000372308800036; EI: 20160301826973)

64. Jianfeng Yan, Dongyue Zhang, Guisheng Zou, Lei Liu, Hailin Bai,Aiping Wu and Y. Norman Zhou. Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment. Journal of Nanomaterials, 2016, Article ID 5284048. (SCI 000371521800001; EI: 20161202132137)

63. J. Wei, Y. Ye, Z. Sun*, L. Liu, G. Zou*. Control of the kerfs size and microstructureinInconel 738 superalloy by femtosecond laserbeam cutting. Applied Surface Science 370, 2016: 364-372. (SCI: 000374075000046; EI: 20161202140876)

62. Xiaoguang Chen, Ruishan Xie, Zhiwei Lai, Lei Liu, Guisheng Zou, Jiuchun Yan. Ultrasonic -assisted brazing of Al-Ti dissimilar alloy by filler metal with large semi-solid temperature range. Materials and Design 95, 2016:296-305. (SCI: 000371295200034; EI: 20161102091300)

61. Luchan Lin, Lei Liu, Peng Peng, Guisheng Zou, Walt W Duley and Y Norman Zhou. In situ nanojoining of Y- and T-shaped silver nanowires structures using femtosecond laser radiation. Nanotechnology 27 (2016) 125201 (11pp). (SCI: 000370442900006; EI: 20160902039834)

60. L. Liu, D. Shen, G. Zou, P. Peng, Y. Zhou. Cold Welding of Ag Nanowires by Large Plastic Deformation. Scripta Materialia. 2016, 114:112-116. (SCI: 000369456900025; EI: 20160301820420)

59. Z. Lai, C. Pan, R. Xie, L. Liu, G. Zou*. Joining Mg Alloys with Zn Interlayer by Novel Ultrasonic-Assisted Transient Liquid Phase Bonding Method in Air. Materials Letters. 2016, 166:219-222. (SCI: 000369061100055; EI: 20160101749380)

58. L. Liu, G. Zou, H. Mori, S. Esmaeili, Y.N. Zhou. Nanostructure of Immiscible Mg–Fe Dissimilar Weld without Interfacial Intermetallic Transition Layer. Materials & Design. 2016, 92:445-449. (SCI: 000369191900052; EI: 20160401838971)

57. Ruishan Xie, Xiaoguang Chen, Zhiwei Lai, Lei Liu, Guisheng Zou*, Jiuchun Yan, WenxianWang. Microstructure, Mechanical Properties and Mechanism of Ultrasound-Assisted Rapid Transient Liquid Phase Bonding of Magnesium Alloy in Air. Materials & Design. 2016, 91:19-27. (SCI: 000367235400003; EI: 20160201787186)

56. 康举, 李吉超, 冯志操, 邹贵生, 王国庆, 吴爱萍. 2219-T8铝合金搅拌摩擦焊接头力学和应力腐蚀性能薄弱区研究. 金属学报, 2016, 52: 60-70. (SCI: 000369466200008; EI: 20141717618853)

55. Daozhi Shen, Guisheng Zou, Lei Liu*, Walter W. Duley and Y. Norman Zhou. Investigation of Splashing Phenomena During the Impact of Molten Sub-Micron Gold Droplets on Solid Surfaces. Soft Matter. 2016, 12:295-30. (SCI 000366863800034; EI: 20155201721960)

54. Yujie Li*, Yao Huo, Changguang Li, Songling Xing, Lei Liu, Guisheng Zou. Thermal analysis of Cu-organic composite nanoparticles and fabrication of highly conductive copper films. Journal of Alloys and Compounds 649, (7), 2015: 1156-1163. (SCI: 000361159000158; EI: 20153201125825)

53. J. Brenneman, J. Wei, Z. Sun, L. Liu, G. Zou, Y. Zhou. Oxidation behavior of GTD111 Ni–based superalloy at 900° C in air, Corros. Sci., 100, Nov.2015: 267-274. (SCI: 000363070100024)

52. Yujie Li, Di Li, Changguang Li, Hongliang Wang, Daozhi Shen, Lei Liu, Guisheng Zou b .Annealing-induced highly-conductive and stable Cu–organic composite nanoparticles with hierarchical structures. Journal of Alloys and Compounds636, (02), 2015: 1-7. (SCI: 000351836600001; EI: 20151000602848)

51. Peng Peng*, Anming Hu,Adrian P. Gerlich, Guisheng Zou, Lei Liu, Y. Norman Zhou.Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties and Applications.ACS Appl. Mater. Interfaces, 2015, 7 (23): 12597-12618. (SCI: 000356753500031; EI: 20152600970398)

50. Jianfeng Yan, Guisheng Zou, Lei Liu, Dongyue Zhang, Hailin Bai, Ai-ping Wu, Y. Norman Zhou. Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications.WELDING IN THE WORLD, 59(3), 2015.5:427-432. (SCI: 000354742900012; EI: 20151700788739)

49. Luchan Lin, Hong Huang, Mugunthan Sivayoganatha, Lei Liu, Guisheng Zou, Walter Duley, Y. Norman Zhou. Assembling of silver nanoparticles and nanowires into well-arranged nanostructures by femtosecond laser irradiation. APPLIED OPTICS, 54(9), 2015: 2524-2531. (SCI: 000351638300049)

48. Yingchuan ZHANG, Lei LIU, Guisheng ZOU, Na CHEN, Aiping WU, Hailin BAI, Yunhong ZHOU. Femtosecond Laser-induced Phase Transformations in an Amorphous Cu77Ni6Sn10P7 Alloy .Journal of Applied Physics 117, 2015: 023109 -1~023109 -5. (SCI: 000348129300009)

47. Dongyue Zhang*, Lei Liu, Guisheng Zou, Yinchuan Zhang, Chen Yu, Aiping Wu, Y.Norman Zhou, Hailin Bai. Synthesis with Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic. Materials Transactions, 56(8), 2015:1252 -1256. (SCI: 000362157600017; EI: 20153201105869)

46. Peng Peng, Peng He, Guisheng Zou, Lei Liu and Y. Norman Zhou Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste near RoomTemperature.Materials Transactions, Mater.Trans. 56(7), 2015: 1010-1014. (SCI: 000361156900023）

45. Zhenyu Zhao*, Chuan Chen*, Liu Liu, Jian Cai, Guisheng Zou, Qian Wang, Yuming Wang, Changyong Park. Effects of package on head-in-pillow defects

44. Wang Yuming, Zhao Zhenyu, Chuan Chen, Wu Liang, Dong Chun, Bai Han, Zou Guisheng, Cai Jian, Wang Qian. Research on Factors Influencing the Board Level Product Quality.2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014), Chengdu, China, 12 -15August: 363-368. (SCI 000366592100084; EI 20144400134070)

43. Chuan Chen, Jian Cai, Qian Wang, Yuming Wang, Guisheng Zou, Zhengyu Zhao, Chang Yong Park. Characterization of After-Reflow Misalignment on Head-in-Pillow Defect in BGA Assembly.2014 15thInternational Conference on Electronic Packaging Technology (ICEPT 2014), Chengdu, China, 12-15August: 1177-1180. (SCI: 000366592100263; EI: 20144400134166)

42. Fengwen Mu*, Zhenyu Zhao, Guisheng Zou, Hailin Bai, Aiping Wu, Lei Liu, Dongyue Zhang, Y. Norman Zhou. Mechanism of Low Temperature Sintering-Bonding through In-Situ Formation of Ag Nanoparticles Using Ag2O Microparticles. Materials Transactions (JIM)，2013,54(6): 872-878. (SCI: 191NB; EI: 20132516432597)

41. Jianfeng Yan*, Guisheng Zou, Yingchuan Zhang, Jiaxin Li, Lei Liu, Aiping Wu and Y. Norman Zhou. Metal to Metal Bonding Process Using Cu+Ag Mixed Nanoparticles. Materials Transactions (JIM), 2013, 54(6): 879-883. (SCI: 191NB; EI: 20132516432598)

40. L. Liu, P. Peng*, A. Hu, G. Zou, W. W. Duley, Y. Zhou. Highly localized heat generation by femtosecond laser induced plasmon excitation in Ag nanowires. Applied Physics Letters, 2013, 102(7): 073107-1-073107-4. (SCI: 099CK; EI: 20131016088585)

39. L. Liu, H. Huang*, A. Hu, G. Zou, L. Quintino, Y. Zhou. Nano Brazing of Pt-Ag Nanoparticles under Femtosecond Laser Irradiation.Nano-Micro Letters, 2013,5(2): 88-92.（SCI:193OC）

38. JIANFENG YAN*, GUISHENG ZOU, AIPING WU, JIALIE REN, ANMING HU and Y.NORMAN ZHOU. Polymer-Protected Cu-Ag mixed NPs for Low-Temperature Bonding application. Journal of Electronic Materials, 2012, 41(7): 1886-1892.（SCI: 950NB: EI :20122515125912）

37. JIANFENG YAN*, GUISHENG ZOU, AIPING WU, JIALIE REN, ANMING HU and Y.NORMAN ZHOU. Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in Low Temperature Bonding Process with Silver Nanoparticles.Journal of Electronic Materials, 2012, 41(7): 1924-1930. (SCI: 950NB; EI: 20122515125902)

36. Jianfeng YAN*, Guisheng ZOU, Ai-ping Wu, Jialie Ren, Jiuchun YAN, Anming HU, Y.ZHOU. Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging. Scripta Materialia, 2012, 66: 82-585. (SCI 912QY; EI 20120914825880)

35. G. Zou, Y.D. Huang, A. Pequegnat, X.G. Li, M.I. Khan, Y. Zhou. Crossed-wire Laser microwelding of Pt-10 Pct Ir to 316 low-carbon vacuum melted stainless steel: Part I. Mechanism of joint formation. Metall. Mater. Trans. A, 2012, 43(4): 1223-1233.(SCI: 000300520700012; EI:20121414929541）

34. Y.D. HUANG, A.PEQUEGNAT, G. S. ZOU, J.C.FENG, M.I.KHAN and Y.ZHOU. Crossed-wire laser microwelding of Pt-10%Ir to 316 LVW stainless steel Part II: Effect of orientation on joining mechanism.Metall. Mater. Trans. A, 2012, 43(4): 1234-1243.(SCI: 000300520700013; EI:20121414929542）

33. Wei Guo, Zou Guisheng, Chai Xiao, Wu Aiping, Zheng Minghui, Jiao Yulei, Ren Jialie. The study of multiple thermal cycle of HTS YBCO bulk.Physica C 474, 2012:25-28. (SCI 901CL; EI 20120814786656)

32. Xia Haiyang*, Wu Aiping, Fan Yinglong*, Zou Guisheng, Ren Jialie. Effects of ion implantation on the brazing properties of high purity alumina. Surface and Coatings Technology, 206(2012), 8-9: 2098-2014. (SCI: 894WP; EI: 20120114664019)

31. Jianfeng Yan*, Guisheng Zou, Aiping Wu, Jialie Ren, Jiuchun Yan, Anming Hu, Lei Liu, Y.Norman Zhou. Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packaging application. Journal of Physics: Conference Series 379 (2012) 012024:1-6.（SCI:BBO07; EI:20124415629351）

30. Jianfeng YAN, Guisheng ZOU, Anming HU, Y.Norman ZHOU. Preparation of polymer coated Cu NPs and its applications for Low-Temperature Bonding. Journal of Materials Chemistry, 2011, 21:15981-15986. (SCI: 000295580800022; EI: 20114114414471)

29. Zhihua Song, Aiping Wu, Guoqing Wang, Guisheng Zou, Jialie Ren. Embrittlement of Ti-23Al-17Nb alloy laser welded joint at 650℃.Proceedings of the 7th International Forum on Advanced MaterialScience and Technology (IFAMST-7), June 26-28, 2010, Dalian, China (SCI: 000297036200173)

18. Jianfeng Yan🧗🏿‍♀️，Guisheng Zou🙎🏼‍♂️，Xiaoyu Wang🦹🏽‍♀️🏹，Hailin Bai4️⃣，Fengwen Mu🟥🦺，Aiping Wu Large-Scale Synthesis of Ag Nanoparticles by Polyol Process for Low Temperature Bonding Application. 2011 International Conference on Electronic Packaging Technology & High Density Packaging：254-259（978-1-4577-1769-7/11/$26.00 🈵？2011 IEEE）（SCI :000309781000056; EI:12345839）

27. Fengwen Mu, Guisheng Zou, Jianfeng Yan, Hailin Bai, Aiping Wu. A Study on the Low Temperature Sintering-Bonding through In-Situ Formation of Ag Nanoparticles Using Ag2O Microparticles. 2011 International Conference on Electronic Packaging Technology & High Density Packaging：293-301（978-1-4577-1769-7/11/$26.00 🏊🏽‍♀️？2011 IEEE）(SCI: 000309781000063; EI:12345846)

26. X. Hu, G. Zou, S. J. Dong, M. Y. Lee, J. P. Jung and Y. Zhou. Effects of Steel Coatings on Electrode Life in Resistance Spot Welding of Galvannealed Steel Sheets. Materials Transactions, 2010, 51(12): 2236-2242. (SCI: 721XE; EI: 20110613653349)

25. Chai Xiao, Zou Guisheng, Guo Wei, Wu Aiping, He Jiarun, Bai Hailin, Xiao Ling, Jiao Yulei, Ren Jialie. Fast joining of melt textured Y-Ba-Cu-O bulks with high quality. Physica C, 2010, 470: 598-601. (SCI 629QN; EI 20102513020655)

24. Guo Wei, Zou Guisheng, Chai Xiao, Wu Aiping, He Jiarun, Bai Hailin, Ren Jialie, Jiao Yulei Joining of textured YBCO with YBCO added Ag2O additive. Physica C, 2010, 470: 482-486. (SCI: 616VI; EI: 20102413005113)

23. Guo Wei, Zou Guisheng, Wu Aiping, Zhou Fangfbin, Ren Jialie. Fabrication of Bi-223/Ag superconducting tapes with BSCCO superconducting powders by diffsuion bonding. Physica C, 2010, 470 (9-10): 440-443. (SCI: 000278285900004)

22. Wang Guo-qing, Wu Ai-ping, Zhao Yue, Zou Gui-sheng, Chen Qiang, Ren Jia-lie.Effect of post-weld heat treatment on microstructure and properties of Ti-23Al-17Nb alloy laser beam welding joints.TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA. 2010, 20, (5): 732-739. (SCI: 600UB）

21. Guo Wei, Zou Guisheng, Wu Aiping, Bai Hailin, Ren Jialie.Soldering of Bi-2223/Ag high temperature superconducting tapes with Sn-Pb- Bi-Ag alloy paste. Physica C, 2010, 470:115-119. (SCI 560PE, EI: 20100512676872)

20. Guo Wei, Zou Guisheng, Wu Aiping, Wang Yanjun, Bai Hailin, Ren Jialie.Superconducting joint of Bi-2223/Ag superconducting tapes by diffusion bonding. Physica C, 2009, 469: 1898-1901. (SCI: 504LR; EI: 20093712296907)

19. Guo Wei, Zou Guisheng, Wu Aiping, Wang Yanjun, Bai Hailin, Ren Jialie. Study of air heat treatment on Bi-2223/Ag superconducting tapes. Physica C, 2009, 469: 778-781. (SCI: 463DC; EI: 20092312116155)

18. Guisheng ZOU, Erhu XIE, Hailin BAI, Aiping WU, Qing Wang, Jialie REN. A study on the TLP diffusion bonding of Ti-22Al-25Nb alloy. Materials Science and Engineering A 499, 2009: 101-105. (SCI: 383VW; EI: 084711718906)

17. 邹贵生，谢二虎，白海林，吴爱萍，任家烈，王庆. Ti2AlNb合金Ti-22Al-25Nb的TLP扩散连接研究. 稀有金属材料与工程🧘🏽‍♀️，2008🎴，37（12）: 2181-2185. (SCI: 395SA; EI: 20090711906628)

16. Yanjun Wang, Guisheng Zou, WeiGuo, Aiping Wu, Hailin Bai, Xiuhua Song, Jun ZONG. Diffusion bonding with a powder interlayer between Bi-Sr-Ca-Cu-O superconducting tapes. Journal of Computational and Theoretical Nanoscience, 2008, 5(8):1587-1591. (SCI: 301FA)

15. Yao Wei, Wu Aiping, Zou Guisheng, Ren Jialie. 5A06/TA2 diffusion bonding with Nb diffusion-retarding layers. Materials Letters, 2008, 62: 2836-2839 (SCI: 314AI)

14. Yao Wei, Wu Aiping, Zou Guisheng, Ren Jialie. Formation process of the bonding joint in Ti/Al diffusion bonding. Materials Science & Engineering A, 2008, 480: 456-463. (SCI: 301FA)

13. Guisheng Zou, Yanjun Wang, Aiping Wu, Hailin Bai, Naijun Hu, Xiuhua Song, Hanping Yi. Efficient diffusion bonding between BSCCO superconducting multi-filamentary tapes. Materials Science Forum, 2008, 580-582: 295-298 (SCI: BIC36; EI: 084711718159)

12. 姚为🫒，吴爱萍，邹贵生，任家烈. Ti/Al扩散焊接中的接头组织结构及其形成规律. 稀有金属材料与工程, 2007, 36(4):700-704. (SCI: 168YT, EI: 072410652101)

11. 吴爱萍👥🎪，邹贵生🌯，马雪梅🦸🏻，任家烈. 钼与石墨的扩散焊接. 稀有金属材料与工程🏇，2006🚵🏿‍♂️，35(9): 1492-1496. (SCI: 092GP; EI: 064710258820)

10. 张德库, 吴爱萍, 邹贵生, 刘根茂. 利用金属间化合物增强陶瓷钎焊接头. 稀有金属材料与工程, 2006, 35(3): 423-427. (SCI: 029YM; EI: 06209882366)

9. Liu Gen-mao, Zou Gui-sheng, Wu ai-ping, Zhang De-ku. Improvements of the Si3N4 brazed joints with intermetallics. Materials Science and Engineering A. 2006, 415: 213-218. (SCI: 997TH; EI: 05529618171)

8. Zou GS, Wu AP, Ren JL, Yang J, ZhaoWQ. Ceramic bonding and the joint’s strengthening through forming intermetallic compounds in situ. Transactions of Nonferrous Metal Society of China. 2004, 14(1): 93-98. (SCI: 800NI; EI: 04268238281)

7. Bao, MD; Xu, JF; Xu, XB; Zou, GS; Huang, GH. Huang Geng-hua. Study on interface structure and bond properties between cemented carbide and tool steel blazing with amorphous alloy. 14th Congress of International Federation for Heat Treatment and Surface Engineering, Vols. 1 and 2:101-104. (SCI: 000228664200023)

6. 邹贵生, 吴爱萍, 任家烈, 等. Al/Ti/Al复合层原位生成金属间化合物连接陶瓷. 稀有金属材料与工程. 2003, 32(12): 981-985. (SCI: 761MK; EI: 0408802935)

5. Zou GS, Yang J, Wu AP, Huang GH, Zhang DK, Ren JL, Wnag Q. Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers. Journal of Materials and Technology. 2003, 19(suppl.1):189-192. (SCI: 813HS; EI: 04328307241)

4. A.P.Wu, G.S.Zou, J.L.Ren, H.J.Zhang, G.Q.Wang, X.Liu, M.L.Xie. Microstructures and mechanical properties of Ti-24Al-17Nb (at.%) laser beam welding joints. Intermetallics, 2002, (10):647-651. (SCI:583EE; EI: 02327046060）

3. Zou Gui-sheng, Wu Ai-ping, REN Jia-lie. Solid-liquid state pressure bonding of Si3N4 ceramics with aluminum based alloys and its mechanism. Trans. Nonferrous Met. Soc. China. 2001, 11(2):178-182. (SCI 419KB; EI: 01536784956)

2. AIPING WU, GUISHENG ZOU, JIALIE REN, WEIJIA REN, SHENG LI. Heat resistant joints of Si3N4 ceramics with intermetallic compounds formed in situ. Journal of Mater. Sci. 2001, 36: 2673-2678. (SCI: 434VM; EI: 01336616224)

1. Aiping Wu, Weijia Ren, Haiyan Zhao, Guisheng Zou, Jialie Ren. Effects of shrinkage fitting on the welding residual stresses of large electromotor rotor. Mathematical Modelling of Weld Phenomena 6 (6th International Seminar of Numerical Analysis of Weldability. 2001.10, Graz, Austria), Edited by H. Cerjak, Maney Publishing: 741-749. (SCI: BCR37-5)

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